LED heat dissipation substrate introduced

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In general, the heat generated by led panel light light can not export, will make the LED junction surface temperature, thereby affecting the product life cycle, lumin ous efficiency, stability, and the LED junction surface temperature, luminous efficiency and life relationship, the following diagram for further instructions.

1, the LED thermal path

Depending on the packaging technology, the cooling method also different, LED various cooling channels can generally be under signaled:

The thermal path Description:

(1). The heat from the air

(2). Heat directly derived from System circuit board

(3). Heat export through the gold wire

(4). For the eutectic and Flip chip process, the heat will be derived through the through-hole to the system board

In general, the LED grain (Die) to fight the golden thread, eutectic or flip chip way to link its substrate (Substrate of LEDDie) and the formation of an LED chip (chip), then fixed and then the LED chip to the circuit of the system panel (System circuitboard). LED possible thermal path for heat from the air, or by the LED die substrate to the system board to the atmospheric environment. Heat from the system board to the rate of the atmospheric environment depends on the entire led lights for homes  system design.

However, at this stage of the cooling of the entire system bottlenecks, mostly dominated in the heat conduction from the LED die to the substrate to the system board. Possible in this part of the cooling channels: One is a direct by grains substrate cooling to the system board, in this thermal path, the heat dissipation capability of the LED die substrate material is a very important parameter. On the other hand, the LED generated by the heat will be through the electrode metal wire to the system board, in general, the use of gold thread to do the geometry is limited by electrode bonding, heat the metal wire itself more slender; therefore recently that the eutectic (Eutectic) or flip chip (Flip chip) bonding way, this design significantly reduce the wire length, and a substantial increase in wire cross-sectional area, this way, by the cooling efficiency of the LED electrode wire to the system board improved.