LED lighting application structure "Quartet"

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LED is called the fourth generation of lighting source of light or green light, with energy saving, environmental protection, long life, small size, can be widely applied in various directions, display, decorative, and backlighting, general lighting and urban night scene of the field. In recent years, some of the world s economically developed countries around the development of LED launched a fierce technology race.

   Light rate determines the level of led high bay lighting source applications

   LED lamps and traditional lamps have a totally different structure, and the structure of its characteristics have a key role, modern LED lamps from five parts of the LED light source, optical system, driver genital, radiator, standard lamps interface.

    Germany the amount of a chip on silica gel mixed with the nano-phosphors allows the refractive index increased to 1.8, to reduce light scattering, to improve the efficiency of the LED light and effective in improving the quality of light and color. Usually phosphor size in 1um above the refractive index of greater than or equal to 1.85, while the silicone refractive index of 1.5 , because the two do not match with the refractive index of the phosphor particle size is much larger than the light-scattering limit (30nm), thus phosphor particle surface light scattering, reducing the rate of light.

    White LED through three forms: (1), using red, green, blue tri-color LED combination light that is multi-chip white LED; (2) blue LED chip and yellow phosphor, blue and yellow color complementary get white or blue LED chips with red and green phosphors, issued by the chip blue phosphors emit red and green color mixed to obtain white light; (3) UV LED chip emits near-ultraviolet excitation fluorescence of tricolor powder to get white. Widely used is the second way, the blue LED chip and yellow phosphor, and complement each other to get white light. Therefore, such a chip to improve the LED luminous efficiency, decided to maintain the rate of the initial luminous flux and light in the blue chips.

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 & nbsp;  While the blue chips of the initial luminous flux is to enhance the epitaxial and substrate technology development. The lumen maintenance to keep the light through the packaging technology, the key is to maintain the lumen maintenance to improve the electrical conductivity and thermal environment within the LED package of key technology: low thermal resistance packaging technology and high light extraction rate package structure and process, which involves the . For now, the existing level of LED luminous efficiency, 80% of the input electrical energy transformed into heat, chip cooling heat is critical. The thermal resistance of LED packages including the material of the internal thermal resistance and the interfacial thermal resistance. Cooling base s main function is to absorb the heat generated by the chip, and conduction to the thermal resistance on the realization of the heat exchange with the outside world; reduction in the interface and the interface ther mal contact resistance, thermally enhanced, is also key, so the chip and heat-based thermal interface The material selection is very important, low temperature or eutectic solder paste or silver plastic. The thermal plastic used in Germany the amount of illumination of the LED chip is within the doped nanoparticles thermal plastic, effectively improve the interface heat transfer, reducing the interfacial thermal resistance, and accelerated cooling of the LED chip.

    LED process, the loss of radiative recombination to produce photons in the outward emission, mainly in three aspects, the chip internal structural defects and the absorption, photon reflection losses caused by the refractive index difference in the outgoing interface; due to the angle of incidence greater than the total reflection critical angle leads to the total reflection losses; effective in reducing the loss of photons at the interface to improve the light extraction rate through the transparent layer covering a layer of refractive index is relatively high on the chip surface. Therefore has a high transmittance, high refractive index, good thermal stability, good fluidity, easy to spray, with order to improve the reliability of the high bay lighting package, it requires a low moisture absorption, low-stress and anti-aging properties. And usually white LED chip issued by blue excitation yellow phosphor synthesis of light-emitting plastic packaging needed to join the yellow phosphor ratio blending, so the phosphor excitation efficiency and conversion efficiency is the key to high light efficiency.